发明名称 |
ENVIRONMENTALLY-ASSISTED TECHNIQUE FOR TRANSFERRING DEVICES ONTO NON-CONVENTIONAL SUBSTRATES |
摘要 |
A device fabrication method includes: (1) providing a growth substrate including a base and an oxide layer disposed over the base; (2) forming a metal layer over the oxide layer; (3) forming a stack of device layers over the metal layer; (4) performing interfacial debonding of the metal layer to separate the stack of device layers and the metal layer from the growth substrate; and (5) affixing the stack of device layers to a target substrate. |
申请公布号 |
US2013344679(A1) |
申请公布日期 |
2013.12.26 |
申请号 |
US201313791214 |
申请日期 |
2013.03.08 |
申请人 |
LEE CHI-HWAN;KIM DONG RIP;ZHENG XIAOLIN |
发明人 |
LEE CHI-HWAN;KIM DONG RIP;ZHENG XIAOLIN |
分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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