发明名称 Monitor Structures and Methods of Formation Thereof
摘要 In accordance with an embodiment of the present invention, a method of forming an electronic device includes forming a first opening and a second opening in a workpiece. The first opening is deeper than the second opening. The method further includes forming a fill material within the first opening to form part of a through via and forming the fill material within the second opening.
申请公布号 US2013341620(A1) 申请公布日期 2013.12.26
申请号 US201213531129 申请日期 2012.06.22
申请人 BIRNER ALBERT;HERZIG TOBIAS;INFINEON TECHNOLOGIES AG 发明人 BIRNER ALBERT;HERZIG TOBIAS
分类号 H01L23/544;H01L21/66 主分类号 H01L23/544
代理机构 代理人
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