发明名称 |
Monitor Structures and Methods of Formation Thereof |
摘要 |
In accordance with an embodiment of the present invention, a method of forming an electronic device includes forming a first opening and a second opening in a workpiece. The first opening is deeper than the second opening. The method further includes forming a fill material within the first opening to form part of a through via and forming the fill material within the second opening. |
申请公布号 |
US2013341620(A1) |
申请公布日期 |
2013.12.26 |
申请号 |
US201213531129 |
申请日期 |
2012.06.22 |
申请人 |
BIRNER ALBERT;HERZIG TOBIAS;INFINEON TECHNOLOGIES AG |
发明人 |
BIRNER ALBERT;HERZIG TOBIAS |
分类号 |
H01L23/544;H01L21/66 |
主分类号 |
H01L23/544 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|