| 摘要 |
The invention relates to a module package which comprises a module substrate 1, a chip 2, 3 applied using the flip chip process, and an encapsulation layer 8, and to a method for producing same. The chip 2, 3 has component structures on the top side 13, 14 thereof. Said top said 13, 14 faces the module carrier 1, wherein a gap 4, 5 is formed between the top side 13, 14 of the chip and the module carrier 1. A filler is added to the encapsulation layer 8. The encapsulation layer 8 partly fills underneath the chip 2, 3, wherein at most the part of the chip 2, 3, on which no component structures are present, is underfilled, and at a minimum the material of the encapsulation layer 8 completely encloses the sides of the chip 2, 3. |
