发明名称 FILM FORMING METHOD AND FILM FORMING APPARATUS
摘要 In a film forming method, a coating composition containing film components is coated on a plastic substrate to form a coating film. By irradiating electromagnetic waves to the coating film, the coating film is dried and/or modified to form a film. The film can be a conductor film, a semi-conductor film or a dielectric film. When forming a conductor film, a coating composition containing metallic nanoparticles is used as the coating composition; when forming a semi-conductor film, an organic semi-conductor material is used as the coating composition; and when forming a dielectric film, an organic dielectric material is used as the coating composition.
申请公布号 US2013344703(A1) 申请公布日期 2013.12.26
申请号 US201313974876 申请日期 2013.08.23
申请人 TOKYO ELECTRON LIMITED 发明人 SHIMIZU MASAHIRO;ITOH HITOSHI
分类号 B05D7/02;H01B19/04;H01L21/02;H05K3/10 主分类号 B05D7/02
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