发明名称
摘要 A method is presented for assembling a component (30) with a flexible substrate (10), the component having electric contacts (31). The method comprises the steps of - placing the component (30) on a first main side (11) of the substrate, - applying a machine vision step to estimate a position of the electric contacts, - depositing one or more layers (32) of an electrically conductive material or a precursor thereof, said layer extending over an area of the substrate defined by the component to laterally beyond said area, - calculating partitioning lines depending on the estimated position of the electric contacts, - partitioning the layer into mutually insulated areas (32d) by locally removing material from said layer along said partitioning lines. Also an apparatus is presented that is suitable for carrying out the method. In addition an assembly is present that can be obtained by the method and the apparatus according to the invention.
申请公布号 JP2013546188(A) 申请公布日期 2013.12.26
申请号 JP20130541948 申请日期 2011.12.02
申请人 发明人
分类号 H05K3/32;H01L21/50;H05K3/34 主分类号 H05K3/32
代理机构 代理人
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