| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing method capable of excellently grinding capable of successfully grinding an optical device wafer by forming a grinding promotion layer allowing a grinding wheel to easily bite into a rear surface side of the optical device wafer by laser processing even if the rear surface of the optical device wafer is a mirror surface.SOLUTION: A wafer processing method for dividing an optical device wafer (W) into individual device chips along a division schedule line (402) formed on a surface turns a rear surface (406) of the optical device wafer (W) into a concavo-convex shape by forming a grinding promotion layer (404) by irradiating the rear surface (406) of the optical device wafer (W) with a laser beam, brings a grinding wheel (221) into contact with the rear surface (406) of the optical device wafer (W) in which the grinding promotion layer (404) is formed, and processes the optical device wafer (W) into a prescribed thickness. |
