| 摘要 |
This disclosure relates to a substrate processing system for substrates with a surface area of greater than 1 m2. The system may include, but is not limited to, load locks and processing chambers that are aligned in a vertical manner. For example, the load locks may be arranged above or below the processing chambers. In turn, the processing chambers may be stacked upon each other in a vertical arrangement. A transfer chamber may also be used to transfer substrates between the load locks and the process chambers. The substrate transfer process may be done under vacuum conditions. |
