WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

摘要

The present invention provides a wiring substrate for preventing the generation of warpage or distortion even if a core substrate is thin and method for manufacturing the same. To solve this problem, the core substrate has a first wiring layer (20). A fiber reinforcement containing resin layer (30) is formed on the core substrate. A primer layer (32) is formed on the fiber reinforcement containing resin layer (30). An interlayer dielectric (40) has a via hole (VH1) passing through the first wiring layer (20). A second wiring layer (22) is connected to the first wiring layer (20) through the via hole (VH1) and formed on the primer layer (32).