| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat spreader, a semiconductor device and a manufacturing method of the same, which achieve improved durability by effectively preventing damages in an adjacent member caused by heat generation of a semiconductor element.SOLUTION: In a semiconductor device 90 employing a heat spreader which includes a spreader frame body 10 integrally equipped in a fixed manner with a substrate 40 on which an IC 50 is mounted, and a spreader top plate 20 having a configuration physically separated from the spreader frame body and connected with the IC 50 via a heat radiation resin 60, the spreader top plate 20 is in a state of being slidably embedded in the spreader frame body 10 and rotation around the gravity center of the spreader top plate is restricted by an internal surface 10A. More specifically, a degree of freedom in a height direction of the spreader top plate 20 is ensured even when the IC 50 and the spreader top plate 20 which are composed of materials having linear expansion coefficients different from each other volume expand due to environmental temperature changes. |
