| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate including a main substrate and a vertical substrate being vertically held on the main substrate, and a method for soldering the vertical substrate.SOLUTION: As shown in Fig. 3 (1), lands 12 provided at front and back sides of an edge 11 of a vertical substrate 10 with a minimum plate thickness are coated with solder 12a, and the vertical substrate 10 with the minimum plate thickness is inserted into an insertion hole 21 of a main substrate 20 by aligning portions coated with the solder 12a to widened portions 21c and 21d in the insertion hole 21 of the main substrate 20. As shown in Fig. 3(2), the vertical substrate 10 with the minimum plate thickness inserted into the insertion hole 21 is slid in a left direction with respect to the insertion hole 21. Sliding as above moves the solder 12a applied to the lands 12 from the widened portions 21c and 21d in the insertion hole 21 to narrowed portions 21a and 21b therein. Moving the solder 12a as above allows the solder 12a to be drawn into a gap between the edge 11 of the vertical substrate 10 with the minimum plate thickness and solder 22a drawn into the insertion hole 21 of the main substrate 20. |
