发明名称 HEAT DISSIPATION SYSTEM FOR POWER MODULE
摘要 Disclosed herein is a heat dissipation system for a power module, including: first cooling medium flow parts and second cooling medium flow parts allowing cooling media to flow in first and second directions, respectively.
申请公布号 US2013343002(A1) 申请公布日期 2013.12.26
申请号 US201213609958 申请日期 2012.09.11
申请人 KIM KWANG SOO;YOO DO JAE;SOHN YOUNG HO;SUH BUM SEOK;JEONG IN WHA;SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM KWANG SOO;YOO DO JAE;SOHN YOUNG HO;SUH BUM SEOK;JEONG IN WHA
分类号 H05K7/20;F28D1/04;F28D15/00 主分类号 H05K7/20
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