发明名称 |
HEAT DISSIPATION SYSTEM FOR POWER MODULE |
摘要 |
Disclosed herein is a heat dissipation system for a power module, including: first cooling medium flow parts and second cooling medium flow parts allowing cooling media to flow in first and second directions, respectively. |
申请公布号 |
US2013343002(A1) |
申请公布日期 |
2013.12.26 |
申请号 |
US201213609958 |
申请日期 |
2012.09.11 |
申请人 |
KIM KWANG SOO;YOO DO JAE;SOHN YOUNG HO;SUH BUM SEOK;JEONG IN WHA;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM KWANG SOO;YOO DO JAE;SOHN YOUNG HO;SUH BUM SEOK;JEONG IN WHA |
分类号 |
H05K7/20;F28D1/04;F28D15/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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