发明名称 INJECTION MOLD DEVICE AND MOLD RELEASING METHOD
摘要 PROBLEM TO BE SOLVED: To obtain an injection mold device which can prevent the roughness of a mold surface contacting with an undercut part without generating a step on the mold surface so that an inclination degree of the undercut of the mold is not restricted.SOLUTION: An injection mold device includes: a fixed side insert die where a protrusion forming a cavity and one undercut part of a mold on a surface facing the cavity is provided; a movable side insert die where a protrusion forming a cavity and the other undercut part of the mold facing the cavity; a spinning insert die through which the movable side insert die is insert; and a spin moving mechanism for making the spinning insert die spin and move it in a direction of the fixed side insert die.
申请公布号 JP2013255998(A) 申请公布日期 2013.12.26
申请号 JP20120131473 申请日期 2012.06.11
申请人 MITSUBISHI ELECTRIC CORP 发明人 TANAKA KEISUKE
分类号 B29C45/44 主分类号 B29C45/44
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