发明名称 |
WIRING CIRCUIT SUBSTRATE, FLEXIBLE SUBSTRATE FOR SUSPENSION, AND METHOD OF PRODUCING FLEXIBLE SUBSTRATE FOR SUSPENSION |
摘要 |
A wiring circuit substrate, comprising: a metal support layer; an insulating layer formed on the metal support layer; a conductive layer for wiring formed on the insulating layer; and an opening formed so as to open at a same location in the insulating layer and the conductive layer for wiring, wherein the metal support layer includes: a support section that supports the insulating layer and the conductive layer for wiring, and a terminal section that extends from one edge side to the other edge side of the opening, the terminal section being separated from the support section; and the conductive layer for wiring includes a wiring that is connected to the terminal section by a connecting section. |
申请公布号 |
US2013342936(A1) |
申请公布日期 |
2013.12.26 |
申请号 |
US201214003372 |
申请日期 |
2012.02.24 |
申请人 |
NISHIYAMA JIN;NARITA YUJI;DAI NIPPON PRINTING CO., LTD. |
发明人 |
NISHIYAMA JIN;NARITA YUJI |
分类号 |
H05K1/11;G11B5/48;H05K3/42 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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