发明名称 WIRING CIRCUIT SUBSTRATE, FLEXIBLE SUBSTRATE FOR SUSPENSION, AND METHOD OF PRODUCING FLEXIBLE SUBSTRATE FOR SUSPENSION
摘要 A wiring circuit substrate, comprising: a metal support layer; an insulating layer formed on the metal support layer; a conductive layer for wiring formed on the insulating layer; and an opening formed so as to open at a same location in the insulating layer and the conductive layer for wiring, wherein the metal support layer includes: a support section that supports the insulating layer and the conductive layer for wiring, and a terminal section that extends from one edge side to the other edge side of the opening, the terminal section being separated from the support section; and the conductive layer for wiring includes a wiring that is connected to the terminal section by a connecting section.
申请公布号 US2013342936(A1) 申请公布日期 2013.12.26
申请号 US201214003372 申请日期 2012.02.24
申请人 NISHIYAMA JIN;NARITA YUJI;DAI NIPPON PRINTING CO., LTD. 发明人 NISHIYAMA JIN;NARITA YUJI
分类号 H05K1/11;G11B5/48;H05K3/42 主分类号 H05K1/11
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