发明名称 CONDUCTIVE MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PRODUCING CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a conductive material capable of efficiently disposing conductive particles on electrodes each having an external surface formed of a material having a thermal conductivity of 200 W/m K, when the electrodes are electrically connected.SOLUTION: A conductive material according to the present invention is used for the electrical connection of electrodes each having an external surface formed of a material having a thermal conductivity of 200 W/m K or more. The conductive material according to the present invention includes a binder resin and conductive particles 1 each having solder on a conductive surface thereof. The conductive material according to the present invention has a thermal conductivity of 0.3 W/m K or less. The conductive material according to the present invention has a minimum melt viscosity of 70 Pa s or less at 40-100°C.
申请公布号 JP2013258139(A) 申请公布日期 2013.12.26
申请号 JP20130104789 申请日期 2013.05.17
申请人 SEKISUI CHEM CO LTD 发明人 ISHIZAWA HIDEAKI
分类号 H01B1/22;H01B1/00;H01R11/01 主分类号 H01B1/22
代理机构 代理人
主权项
地址