发明名称 |
CONDUCTIVE MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PRODUCING CONNECTION STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To provide a conductive material capable of efficiently disposing conductive particles on electrodes each having an external surface formed of a material having a thermal conductivity of 200 W/m K, when the electrodes are electrically connected.SOLUTION: A conductive material according to the present invention is used for the electrical connection of electrodes each having an external surface formed of a material having a thermal conductivity of 200 W/m K or more. The conductive material according to the present invention includes a binder resin and conductive particles 1 each having solder on a conductive surface thereof. The conductive material according to the present invention has a thermal conductivity of 0.3 W/m K or less. The conductive material according to the present invention has a minimum melt viscosity of 70 Pa s or less at 40-100°C. |
申请公布号 |
JP2013258139(A) |
申请公布日期 |
2013.12.26 |
申请号 |
JP20130104789 |
申请日期 |
2013.05.17 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
ISHIZAWA HIDEAKI |
分类号 |
H01B1/22;H01B1/00;H01R11/01 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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