| 摘要 |
PROBLEM TO BE SOLVED: To provide an improvement structure of small-size light-emitting diode packaging for enhancing a light-emitting angle.SOLUTION: An improvement structure of small-size light-emitting diode packaging for enhancing a light-emitting angle includes an opaque base and at least one light-emitting chip. The light-emitting chip is installed on the opaque base, and the opaque base includes a transparent sidewall disposed around the opaque base to form a concave-cup space. The transparent sidewall is formed by a molding method. The concave-cup space is filled with a packaging gel by a dispensing method, and the packaging gel is doped with at least one phosphor powder. Therefore, the transparent sidewall can increase a light-emitting angle to 140° to 180° and reduces the amount of internal reflected light to avoid the occurrence of a yellow ring phenomenon. Moreover, the phosphor powder can enhance the color manifestation and can enlarge the color gamut. |
