TRAY FOR MANUFACTURING FLUORESCENCE LAYER HAVING AUXILIARY GROOVE AND FLUORESCENCE LAYER MANUFACTURING METHOD AND LED PACKAGE MANUFACTURING METHOD USING THE SAME

摘要

A tray for manufacturing a fluorescence layer according to the present invention forms at least one receiving groove capable of receiving a fluorescence material on upper side and forms an auxiliary groove for receiving the fluorescence material exceeding the volume of the receiving groove on the circumference of the receiving groove when the fluorescence material is inserted into the receiving groove. A method for manufacturing a light emitting diode package using the same comprises; a step of mounting a light emitting diode chip on a substrate; a step of forming at least one receiving groove capable of receiving a fluorescence material on the upper side and of inserting the fluorescence material into the receiving groove of the tray for manufacturing the fluorescence layer in which the auxiliary groove for receiving the fluorescence material exceeding the volume of the receiving groove on the circumference of the receiving groove when the fluorescence material is inserted into the receiving groove is formed; a step of hardening the fluorescence material; a step of separating the hardened fluorescence material from the tray for manufacturing the fluorescence layer; and a step of forming the fluorescence layer by mounting the separated fluorescence material on the light emitting diode chip.