发明名称 |
Package on Package Devices and Methods of Packaging Semiconductor Dies |
摘要 |
Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. In one embodiment, a PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal pillars are coupled to the first packaged die. The metal pillars have a first portion proximate the first packaged die and a second portion disposed over the first portion. Each of the metal pillars is coupled to a solder joint proximate the second packaged die. |
申请公布号 |
US2013341786(A1) |
申请公布日期 |
2013.12.26 |
申请号 |
US201213532402 |
申请日期 |
2012.06.25 |
申请人 |
HSU CHUN-LEI;LIU CHUNG-SHI;LU DE-YUAN;HO MING-CHE;CHEN YU-FENG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HSU CHUN-LEI;LIU CHUNG-SHI;LU DE-YUAN;HO MING-CHE;CHEN YU-FENG |
分类号 |
H01L23/498;H01L21/56 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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