| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for patterning a film pattern on a substrate.SOLUTION: The method includes forming a film pattern on a substrate surface, forming a coating over the substrate and the film pattern, and inducing pores or openings in the coating. At least part of the coating overlying the film pattern is removed, which includes etching at least one layer underlying the coating ahead of removing at least part of the coating. |
