| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a silicon-containing resist lower layer film, capable of reducing a coating defect after film formation by cleaning and removing deposits derived from a silicon-containing resist lower layer film material depositing and adhering in a pipe line of a coating and film formation device.SOLUTION: In a coating and film formation method of a silicon-containing resist lower layer film using spin coating, an alkaline aqueous solution is passed through a pipe line in a coating and film formation device using spin coating to clean the pipe line, and then a silicon-containing resist lower layer film material is supplied through the pipe line. Thus, the silicon-containing resist lower layer film is coated on a substrate to form a film. |
