发明名称 |
INTEGRATED CIRCUIT PACKAGE HAVING OFFSET VIAS |
摘要 |
Integrated circuit packages comprise vias, each of which extends from a pad in communication with an integrated circuit on a semiconductor chip through insulating material overlying the semiconductor chip to an attachment surface facing a substrate. The portion of each via proximate the attachment surface is laterally offset from the portion proximate the pad from which it extends in a direction away from the centre of the semiconductor chip. Metallic material received in the vias mechanically and electrically interconnects the semiconductor chip to the substrate. |
申请公布号 |
US2013341802(A1) |
申请公布日期 |
2013.12.26 |
申请号 |
US201213532126 |
申请日期 |
2012.06.25 |
申请人 |
SU MICHAEL Z.;LEI FU;KUECHENMEISTER FRANK;ADVANCED MICRO DEVICES, INC. |
发明人 |
SU MICHAEL Z.;LEI FU;KUECHENMEISTER FRANK |
分类号 |
H01L23/528;H01L21/768 |
主分类号 |
H01L23/528 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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