| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for processing an optical device capable of further improving light extraction efficiency.SOLUTION: A method for processing an optical device from an optical device wafer in which an optical device including an electrode is formed in each region of a surface partitioned by a plurality of intersecting division schedule lines comprises the steps of: forming a groove along the division schedule lines from a rear surface of the optical device wafer and forming a small residual part on a surface side of the optical device wafer; forming a reflection film at least on a side surface of the groove by coating the reflection film from a rear surface side of the optical device wafer after performing the groove formation step; thinning the optical device wafer to finishing thickness by grinding the rear surface of the optical device wafer after performing the reflection film formation step; and dividing the optical device wafer into individual optical device chips by dividing the residual part along the division schedule lines after performing the grinding step. |
