| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and system of forming a substantially planar face in a substrate.SOLUTION: The method comprises: directing at least one beam at a first surface of a substrate to remove material from the substrate, the beam being offset from a normal to the first surface by a nonzero curtaining angle; sweeping the beam in a plane that is perpendicular to the first surface to mill one or more initial cuts in the substrate so as to expose a second surface that is substantially perpendicular to the first surface; rotating the substrate through a nonzero rotation angle about an axis other than an axis that is normal or parallel to the beam; directing the first beam at the second surface to remove additional material from the substrate without changing the nonzero curtaining angle; and scanning the beam in a pattern across the second surface to mill one or more finishing cuts in the substrate. |
