| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a reed switch capable of manufacturing a reed switch including a contact having a multilayered plating layer at the tip of a reed piece, in which peeling of a surface plating layer due to palladium is suppressed even when palladium is used in a base plating layer, and to provide a reed switch obtained by that manufacturing method.SOLUTION: The manufacturing method of a reed switch 10 where one ends of a pair of reed pieces 12A, 12B are contacts 16A, 16B enclosed in a container 14 in a vacuum state or together with an inert gas, at least includes the steps of: forming a base plating layer 20 by applying palladium plating to the contacts; applying dehydrogenation treatment to the contact subjected to palladium plating, by anode electrolysis; and forming a surface plating layer 22 by performing surface plating at the contact subjected to dehydrogenation treatment. |
