LEAD FRAME, MANUFACTURING METHOD OF ELECTRONIC CIRCUIT MODULE, AND ELECTRONIC CIRCUIT MODULE

摘要

PROBLEM TO BE SOLVED: To provide a lead frame which prevents warp and deformation of the lead frame when an insulative magnetic material is compressively molded thereby preventing the deterioration of the adhesion between a magnetic material part and a wiring part.SOLUTION: An electronic circuit module includes: a magnetic material part which is formed by compressively molding an insulation magnetic material with a coil included therein; a wiring part 20 which is formed on one surface of the magnetic material part so that the surface of the wiring part 20 is exposed; and an electronic component disposed in the wiring part 20. A lead frame 100 is used for manufacturing the electronic circuit module and includes: the wiring part 20; an outer frame 110 which is formed at the outer side of the wiring part 20 and supports the wiring part 20; and a connection part 120 which connects the wiring part 20 with the outer frame 110 in a space between the wiring part 20 and the outer frame 110. The connection part 120 includes a stress releasing structure 121 for releasing stress generated along the connection part 120 in a direction from the inner side toward the outer side when the insulation magnetic material is compressively molded.