| 摘要 |
<p>A wiring board of the present invention includes a core layer, a through hole which passes through the core layer in a thickness direction, and an electronic component which is received in the through hole. The through hole includes a first opening part which is formed on a first surface of the core layer, a second opening part which is formed on a second surface of the core layer, and an inner protrusion part which inwardly protrudes relative to the first opening part and the second opening part. The electronic component is maintained on the inner protrusion part.</p> |
