| 发明名称 |
ADHESIVE COMPOUND AND METHOD FOR ENCAPSULATING AN ELECTRONIC ASSEMBLY |
| 摘要 |
<p>The invention relates to the use of an adhesive compound for encapsulating an (opto-)electronic application, containing an organometallically modified polymer created by reacting an elastomer with an organometallic compound, wherein the central atom of the organometallic compound is a metal or metalloid of the 3rd and 4th main groups or 3rd and 4th subgroups.</p> |
| 申请公布号 |
KR20130141588(A) |
申请公布日期 |
2013.12.26 |
| 申请号 |
KR20137015033 |
申请日期 |
2011.10.27 |
| 申请人 |
TESA SE |
发明人 |
STEEN ALEXANDER;KRAWINKEL THORSTEN;KEITE TELGENBUESCHER KLAUS;GRUENAUER JUDITH;ELLINGER JAN |
| 分类号 |
C09J109/06;C09J153/00;H01L23/28 |
主分类号 |
C09J109/06 |
| 代理机构 |
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| 主权项 |
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