发明名称 RESIN COMPOSITION, PREPREG, AND METAL-FOIL-CLADDED LAMINATE BOARD
摘要 There are provided a resin composition which has excellent heat resistance, exhibits high optical reflectance in an ultraviolet light region and a visible light region, undergoes less deterioration in optical reflectance when subjected to a heat treatment, and can be used suitably for an LED-mounting printed wiring board; a prepreg containing the resin composition; and a metal foil-clad laminate containing the resin composition, or the like. The resin composition of the present invention contains a fluorene-containing epoxy resin (A) having a specific structure, an acid anhydride (B) of a completely or partially hydrogenated product of an aromatic polycarboxylic acid, titanium dioxide (C), and a wet dispersing agent (D).
申请公布号 EP2676999(A1) 申请公布日期 2013.12.25
申请号 EP20120747364 申请日期 2012.02.10
申请人 MITSUBISHI GAS CHEMICAL COMPANY, INC. 发明人 MORISHITA, KOJI;KOIZUMI, KAORU;TAKADA, KEISUKE
分类号 C08L63/00;B32B15/092;C08J5/24;C08K3/22;C08K5/1539;C08L101/02 主分类号 C08L63/00
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