发明名称 |
SYSTEM-IN-PACKAGE USING EMBEDDED-DIE CORELESS SUBSTRATES, AND PROCESSES OF FORMING SAME |
摘要 |
An apparatus includes a coreless substrate with an embedded die that is integral to the coreless substrate, and at least one device assembled on a surface that is opposite to a ball-grid array disposed on the coreless substrate. The apparatus may include an over-mold layer to protect the at least one device assembled on the surface. |
申请公布号 |
EP2548225(A4) |
申请公布日期 |
2013.12.25 |
申请号 |
EP20110756940 |
申请日期 |
2011.03.16 |
申请人 |
INTEL CORPORATION |
发明人 |
GUZEK, JOHN, S.;NAIR, VIJAY |
分类号 |
H01L23/48;H01L21/60;H01L23/14 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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