| 发明名称 |
Semiconductor device and method of fabricating the same |
| 摘要 |
<p>A semiconductor device includes a base plate (1), and a semiconductor constituent body (2) formed on the base plate (1). The semiconductor constituent body has a semiconductor substrate (4) and a plurality of external connecting electrodes (5, 12) formed on the semiconductor substrate (4). An insulating layer (14) is formed on the base plate (1) around the semiconductor constituent body (2). A hard sheet (15) is formed on the insulating layer (14).
An interconnection (19) is connected to the external connecting electrodes (5, 12) of the semiconductor constituent body (2).
</p> |
| 申请公布号 |
EP1901349(A3) |
申请公布日期 |
2013.12.25 |
| 申请号 |
EP20070022771 |
申请日期 |
2004.12.21 |
| 申请人 |
TERAMIKROS, INC.;CMK CORPORATION |
发明人 |
JOBETTO, HIROYASU |
| 分类号 |
H01L23/31;H01L23/16;H01L23/498;H01L23/538 |
主分类号 |
H01L23/31 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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