发明名称 PIPE TYPE BUMPER STAY FORMING DEVICE AND MANUFACTURING METHOD
摘要 Disclosed is a pipe-type bumper stay manufacturing device. The disclosed pipe-type bumper stay manufacturing device is to manufacture a pipe-type bumper stay wherein first and second circular pipes are forcibly fitted and joined. The forcibly fitted part of the first pipe is expanded while the fitted part of the second pipe is shrunk. At least one bead is formed on an outer circumference of the first pipe. The pipe-type bumper stay manufacturing device comprises: a lower die installed in a lower base, expanding a forcibly fitted part of the first pipe using an electromagnet force, and forming the bead on the outer circumference of the first pipe; and an upper die installed in an upper slider vertically reciprocating on the lower die, shrinking the forcibly fitted part of the second pipe using an electromagnet force, and forcibly fitting and joining the forcibly fitted part of the second pipe to the forcibly fitted part of the first pipe. The purpose of the present invention is to provide the pipe-type bumper stay manufacturing device and the manufacturing method thereof capable of manufacturing the bumper stay with the pipe forcibly fitted by expanding and shrinking the pipes using an electromagnetic force.
申请公布号 KR20160082581(A) 申请公布日期 2016.07.08
申请号 KR20140192934 申请日期 2014.12.30
申请人 SUNG WOO HITECH CO., LTD. 发明人 JOO, JIN HONG;LEE, MUN YONG
分类号 B21D53/88;B21D41/00;B60R19/24 主分类号 B21D53/88
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