| 摘要 |
The present invention relates to a vertical chemical vapor deposition device. The vertical chemical vapor deposition device comprises: a vertical treatment furnace; an exhaust pipe inserted into a middle portion of the inside of the vertical treatment furnace, and provided with a plurality of exhaust ports formed in a vertical and a horizontal direction to emit gas to the outside through the exhaust ports; a plurality of support units protruding in a circumferential direction of the exhaust pipe to support treatment objects; an isolation wall protruding in a longitudinal direction of the exhaust pipe to shield both sides of the treatment objects; and a plurality of nozzles disposed on the inside of the vertical treatment furnace to spray process gas to the treatment objects isolated by the isolation wall and the support units. The process gas supplied to the treatment objects arranged in a vertical and a horizontal direction can be discharged after passing the treatment objects to improve uniformity of thin films deposited on the treatment objects in the vertical treatment furnace. |
