| 发明名称 | Semiconductor device and method of manufacturing the same | ||
| 摘要 | A semiconductor device with improved reliability is provided. The semiconductor device is characterized by its embodiments in that sloped portions are formed on connection parts between a pad and a lead-out wiring portion, respectively. This feature suppresses crack formation in a coating area where a part of the pad is covered with a surface protective film. | ||
| 申请公布号 | US9391035(B2) | 申请公布日期 | 2016.07.12 |
| 申请号 | US201514685886 | 申请日期 | 2015.04.14 |
| 申请人 | Renesas Electronics Corporation | 发明人 | Tomita Kazuo;Takewaka Hiroki |
| 分类号 | H01L23/48;H01L23/00;H01L21/66;H01L23/31 | 主分类号 | H01L23/48 |
| 代理机构 | Shapiro, Gabor and Rosenberger, PLLC | 代理人 | Shapiro, Gabor and Rosenberger, PLLC |
| 主权项 | 1. A semiconductor device comprising a rectangular semiconductor chip, wherein the semiconductor chip includes: (a) a plurality of pads arranged along an edge side of the semiconductor chip; (b) a lead-out wiring portion provided on each of the plurality of pads; and (c) a sloped portion provided on a connecting part between each of the plurality of pads and the lead-out wiring portion, and wherein the lead-out wiring portion is connected to a side closest to the edge side of the semiconductor chip among a plurality of sides making up each of the plurality of pads. | ||
| 地址 | Tokyo JP | ||