发明名称 High performance electronic system with first and second subsystem
摘要 <p>The system (1) has a subsystem comprising a switch device that is provided with a cooling component thermal conductively connected with a cooling device (10) i.e. water cooling device. Another subsystem has two external direct-current (DC) load terminal elements (24, 26) i.e. screw connections, electric-conductively connected with respective connection units such that the connection units conductively connect internal DC load terminal elements of the subsystems with the external DC load terminal elements with correct polarities. A housing (20) covers the subsystems of the cooling device. The connection units are designed as planar metallic mold-bodies.</p>
申请公布号 EP2528095(B1) 申请公布日期 2013.12.25
申请号 EP20120161485 申请日期 2012.03.27
申请人 SEMIKRON ELEKTRONIK GMBH & CO. KG PATENTABTEILUNG 发明人 FRANK, THOMAS;POPP, RAINER;WEIS, STEFAN
分类号 H01L25/07;H01L23/40;H01L23/473;H01L25/16 主分类号 H01L25/07
代理机构 代理人
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