POLISHING PAD

摘要

A polishing pad comprising at least a polishing layer and a cushion layer, wherein a groove is formed on a polishing surface of the polishing pad, at least one of angles formed by the polishing surface and a side surface of the groove which continues to the polishing surface is 105-150° inclusive, and the cushion layer has a strain constant of 7.3×10 -6 to 4.4×10 -4 µm/Pa inclusive. The use of the polishing pad can achieve a purpose of preventing the fluctuation in a polishing rate while keeping the polishing rate at a high level.