Casing of electronic device and method of manufacturing the same

摘要

A manufacturing method of a casing of electronic device including the following steps: providing a casing body, whereby the material of the casing body is a metal; roughening the surface of the casing body; forming an oxide ceramic layer on a surface of the casing body, wherein the step of forming the oxide ceramic layer on the surface of the casing body is a Micro Arc Oxidation (MAO) process; forming an anti-fingerprint layer (AFP layer) on the oxide ceramic layer. A casing of electronic device including a casing body and an oxide ceramic layer is also disclosed.