发明名称 System and method for bonded configuration pad continuity check
摘要 A continuity test circuit for a boundary pad includes a pull-up transistor electrically connected between the boundary pad and a first power supply, and a pull-down transistor electrically connected between the boundary pad and a first reference ground potential. A normal output conductor is electrically connected to have a same electrical state as the boundary pad during normal operation. A continuity test output conductor is electrically connected to have a same electrical state as the boundary pad during continuity test operation. Continuity testing control circuitry is defined to control the pull-up transistor, the pull-down transistor, and the normal output conductor during continuity test operation such that an electrical state present on the continuity test output conductor indicates a status of electrical continuity between the boundary pad and either a second power supply or a second reference ground potential to which the boundary pad should be electrically connected.
申请公布号 US8614584(B2) 申请公布日期 2013.12.24
申请号 US201113039110 申请日期 2011.03.02
申请人 LIU BAOJING;GUTTA ARUNA;SKALA STEPHEN;SANDISK TECHNOLOGIES INC. 发明人 LIU BAOJING;GUTTA ARUNA;SKALA STEPHEN
分类号 G01R31/02;G01R31/26 主分类号 G01R31/02
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