| 摘要 |
<p>The present invention relates to a wafer gripper. The wafer gripper according to the present invention comprises: an x-axis frame disposed on the upper part thereof; an x-axis moving unit moving along the x-axis frame; a z-axis frame moving vertically by being connected to the x-axis moving unit; a y-axis frame connected the lower part of the z-axis frame and arranged perpendicular to the x-axis frame; a pulling unit moving along the y-axis by being connected to the y-axis frame; and pulling wafers stored in a wafer pusher. As stated above, the wafer gripper according to the present invention has an advantage of minimizing the deformation, which is caused by the weight of wafers, by distributing three spots, since the wafer gripper holds the wafer stored in the wafer pusher by approaching both sides of the wafer and by supporting the lower part of the wafer at the same time.</p> |
