发明名称 |
Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic device |
摘要 |
A semiconductor assembly board includes a supporting board, a coreless build-up circuitry and a built-in electronic device. The supporting board includes a bump, a flange and a via hole in the bump. The built-in electronic device extends into the via hole and is electrically connected to the build-up circuitry. The build-up circuitry extends from the flange and the built-in electronic device and provides signal routing for the built-in electronic device. The supporting board provides mechanical support, ground/power plane and heat sink for the coreless build-up circuitry. |
申请公布号 |
US8614502(B2) |
申请公布日期 |
2013.12.24 |
申请号 |
US201213456293 |
申请日期 |
2012.04.26 |
申请人 |
LIN CHARLES W.C.;WANG CHIA-CHUNG;BRIDGE SEMICONDUCTOR CORPORATION |
发明人 |
LIN CHARLES W.C.;WANG CHIA-CHUNG |
分类号 |
H01L23/495;H01L23/12;H01L23/48 |
主分类号 |
H01L23/495 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|