发明名称 Method of manufacturing bonded member and bonded member manufacturing apparatus
摘要 It can prevent extension of the time required for bonding, even when relatively large members are bonded. a bonded member manufacturing apparatus comprises a first holder 11 for holding a first member D, a second holder 12 for holding a second member E, an application device 40 for applying the intermediate substance G to a first bonded surface Df, a moving device 20 for moving the first holder 11 and/or the second holder 12, and a controller. The controller controls the first holder 11, the second holder 12 and the moving device 20 so that a first extended plane De and a second extended plane Ee are arranged such that the first extended plane De and the second extended plane Ee oppose each other in parallel and such that a range where the first bonded surface Df overlaps with the second bonded surface Ef is equal or smaller than a predetermined range when viewed in a direction of the thickness, and then so that the first member D is moved relatively to the second member E in a direction that the range where the first bonded surface Df overlaps with the second bonded surface Ef gradually increases when viewed in the direction of the thickness while maintaining a distance between the first extended plane De and the second extended plane Ee.
申请公布号 US8613823(B2) 申请公布日期 2013.12.24
申请号 US20100981648 申请日期 2010.12.30
申请人 SUZUKI TAKAYUKI;SAITO TOMOYUKI;NAKAMURA MASAHIRO;ORIGIN ELECTRIC COMPANY, LIMITED 发明人 SUZUKI TAKAYUKI;SAITO TOMOYUKI;NAKAMURA MASAHIRO
分类号 B32B37/00 主分类号 B32B37/00
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