发明名称 Semiconductor devices having lower and upper interconnection structures that exhibit reduced coupling
摘要 An interconnection structure for a semiconductor device may include lower interconnection patterns disposed in a checker board shape and upper interconnection patterns disposed in a checker board shape and connecting two adjacent lower interconnection patterns to each other.
申请公布号 US8614507(B2) 申请公布日期 2013.12.24
申请号 US20100889499 申请日期 2010.09.24
申请人 YOON JOONG-HO;KIM TACKYUNG;ROH KANG-SUP;KIM JUN-SEOK;LEE EUN-JUNG;SAMSUNG ELECTRONICS CO., LTD. 发明人 YOON JOONG-HO;KIM TACKYUNG;ROH KANG-SUP;KIM JUN-SEOK;LEE EUN-JUNG
分类号 H01L23/48 主分类号 H01L23/48
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