METHOD FOR MANUFACTURING SOLDER ON PAD ON FINE PITCH PCB SUBSTRATE AND FLIP CHIP BONDING METHOD OF SEMICONDUCTOR USING THE SAME

摘要

The present invention relates to a method for forming a solder bump on a fine pitch PCB substrate and a flip chip bonding method of a semiconductor device using same and comprises; a steps of spreading a solder bump maker (SBM) paste having regular thickness on the front side of the PCB substrate including a metal pad and a solder mask; a step of forming the solder bump by heating the SBM paste with the temperature higher than a melting point of a solder included in the SBM paste and cooling the SBM paste; and a step of washing a remaining polymer resin of the SBM paste and a remaining solder particle using a solvent.