| 摘要 |
Disclosed is an LED package capable of reducing manufacturing costs by removing a substrate for arranging an LED and having excellent radiating effects. The LED package comprises an electrode structure; an LED element which is electrically connected to the electrode structure; and a mold part which molds the electrode structure and the LED element so that at least one surface of the electrode structure can be exposed. According to the LED package, the costs for manufacturing the LED package can be reduced, and the heat generated in the LED package can be effectively radiated. |
