AG-BASED WIRE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE HAVING THE SAME

摘要

An Ag-based wire for a semiconductor package is provided. According to one embodiment of the present invention, the Ag-based wire for a semiconductor package comprises Au of 5-20 wt%, at least one among Ir, Pd, and Pt, an additive containing 0.5-5 wt%, and Ag.