| 摘要 |
The present invention provides a method for forming silicon-containing resist underlayer film capable of reducing coating defect by cleansing precipitate from a Si-containing resist lower layer material in a coating formation device. The present invention, in the method for forming silicon-containing resist underlayer film, after the pipe of the coating formation device is cleaned by using alkali solution, the a Si-containing resist lower layer material is supplied through the pipe. Therefore, a layer is formed by coating the Si-containing resist lower layer material on a substrate. |
