| 摘要 |
Disclosed are power module semiconductor packages including a flexible circuit board and a method for manufacturing the packages. A semiconductor package comprises the flexible circuit board, a conductive film, a land pad, a heat sink, a passive circuit component, a discrete component, an IC component, and a lead. The conductive film is positioned on a first part of the upper surface of the flexible circuit board. The land pad is positioned on a second part of the upper surface of the flexible circuit board. The heat sink is positioned on a part of a lower surface of the flexible circuit board. The passive circuit component is connected to a part of the conductive film. The lead of a lead frame is connected to the land pad. The packages have a high degree of design flexibility for a package layout; provide a simple design process; shorten a time for designing the packages; and reduce package costs. Other embodiments are disclosed, too. |
