INORGANIC ADHESIVE COMPOSITION AND METHOD FOR HERMETIC SEALING USING THE SAME

摘要

The present invention relates to an inorganic adhesive composition and a sealing method, and more specifically, to an inorganic adhesive composition and a sealing method, wherein an organic solvent is not used. For this, the present invention includes 20-80 wt% of silicate glass diluted solution containing 60-90 wt% of water glass (Na2SiO2), 20-80 wt% of fire resistant inorganic filler, and black pigments. [Reference numerals] (S100) Applying inorganic adhesive composition;(S200) Combine first and second substrates;(S300) Laser irradiation on inorganic adhesive composition