| 摘要 |
FIELD: chemistry.SUBSTANCE: composition contains a liquid phenol resin, having free formaldehyde content lower than or equal to 0.1 wt % per total weight of the liquid, and a compound which is capable of reacting with free formaldehyde. The liquid phenol resin is substantially formed by phenol-formaldehyde and phenol-formaldehyde amine condensates and has pH below 7 and water dilution capacity at temperature of 20°C of at least 1000%. The compound which is capable of reacting with free formaldehyde is selected from a group of compounds with active methylene group(s), alcohols, phenol compounds, amines, amides, hydrazides, nitrogen-containing aromatic heterocyclic compounds, sulphites, sulphamates, imides, natural products and sulphur dioxide.EFFECT: invention enables to reduce toxicity of the gluing composition and material with use thereof, storage stability thereof and enables application of the composition by pulverisation.19 cl, 2 tbl, 14 ex |
