| 摘要 |
A method of manufacturing a subfloor component comprises providing a mold configured to form an insulating foam panel, the mold including pedestal-forming structures for forming the panel to have a plurality of pedestals; placing heat-expandable beads into the mold against the pedestal-forming structures; applying heat to the mold to expand the heat-expandable beads to form the panel, wherein the expansion of the heat-expandable beads causes the expanding beads to enter into and conform to the pedestal-forming structures thereby to form the pedestals of the panel; placing a moisture-resistant film into the mold adjacent to the pedestal-forming structures; applying heat to the mold to fuse the film to the panel, the heat causing the film to enter into and conform to the pedestals and fuse thereto; removing the panel with the fused moisture-resistant film from the mold; and attaching a hardboard layer to the panel. |
