| 摘要 |
A camera module according to the present invention comprises a first printed circuit board in which an image sensor is mounted; a housing unit which is arranged in the upper side of the first printed circuit board; a holder module which is arranged to be spaced from the internal bottom surface of the housing unit in a certain distance and comprises a first coil that winds the peripheral surface thereof and at least one lens formed therein; a plate member which is combined with the bottom surface of the holder module; a second printed circuit substrate which is installed in the upper side of the holder module; a plurality of wire springs in which one end thereof is connected to the plate member, and the other end thereof is connected to the second printed circuit board; and a buffer which is arranged in the connection part of the wire spring and the plate member. |
