| 摘要 |
PROBLEM TO BE SOLVED: To provide a package of a light emitting element or a power semiconductor element, which easily radiates heat to the outside and is easily made small and thin.SOLUTION: A metal base substrate with a feedthrough terminal includes a metal plate 11 excellent in thermal conductivity, at least one through hole provided in the metal plate, a feedthrough terminal 12 inserted through the through hole, and an insulation seal material 13 for sealing the feedthrough terminal to the metal plate, and in the metal plate, upper and lower surfaces including the feedthrough terminal and the insulation seal material are molded and flattened. One flat surface is a chip mounting surface of a semiconductor element, and the semiconductor element and the feedthrough terminal adhered to the chip mounting surface are subjected to wiring connection by a bonding wire or the like, or directly connected to the metal plate with the same potential on the chip mounting surface in addition to the wiring connection. The other flat surface is a surface mounting surface, forms a connection surface with a circuit board and connects another interposer substrate and external circuit board. |
